Laser Depaneling

Laser ablation for high quality depaneling services is a fast growing portion of our overall laser cutting services due to A-laser’s high cut quality, quick turn capability, and unmatched material handling experience. The UV systems use laser ablation to process materials, thus vaporizing rather than melting which creates a clean, burr free edge and leaves virtually no carbon residue. Therefore, circuit failures and extra cleaning processes are greatly reduced with laser ablation; offering a significant cost savings for laser depaneling. Laser ablation for depaneling services is CAD driven which allows for immediate implementation of design changes and laser beams don’t dull or chip, which means there isn’t the added expense or time wasted waiting for hard tools. We are aware that little details, such as wearing proper gloves to avoid oil from fingertips, can have a huge impact post cutting processes and make sure our entire laser cutting group are trained to know the handling requirements of our customers.

Our laser ablation process creates numerous benefits for our customers that are not quite as obvious.

  • <20 micron beam size allows part spacing to be tighter = material savings
  • Customers can push right up to the edge of their board, as there is very little thermal influence
  • High precision cuts (+/- .0005″) add greater reliability
  • Contact free laser ablation and processing ensures the integrity of your panels

It’s important for us at A-Laser to understand the needs of our customers. We have years of experience singulating panels and chips for a wide range of applications. The key is communication so we take the extra steps to be certain our customers receive the best laser cut product available. Laser ablation has become a key component in higher and more reliable performance of electronics components. Our group will always strive to outperform and raise the bar for laser cutting, laser ablating, laser micromachining and post process services in today’s market.