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Laser Depaneling

Laser depaneling is a fast growing portion of our overall laser cutting services due to A-laser’s high cut quality, quick turn capability, and material handling experience. The UV laser systems ablate a material, thus vaporizing rather than melting, creating a nice, burr free edge and leaving virtually no carbon residue. Therefore, circuit failures and extra cleaning processes are greatly reduced; providing cost savings. Laser cutting is CAD driven which allows for immediate implementation of design changes and laser beams don’t dull or chip, which means there isn’t the added expense or time wasted waiting for hard tools. We are aware that little details, such as wearing proper gloves to avoid oil from fingertips, can have a huge impact post cutting processes and make sure our entire laser cutting group are trained to know the handling demands of our customers. 

Our laser depaneling process, also, creates numerous benefits for our customers that are not quite as obvious.

· <20 micron beam size allows part spacing to be tighter = material savings
· Customers can push right up to the edge of their board, as there is very little thermal influence
· High precision cuts (+/- .0005”) add greater reliability
· Contact free laser processing ensures the integrity of your panels

It’s important for a laser cutting service to understand the needs of their customers.  We have years of experience singulating panels and chips for a wide range of applications. The key is communication. We take the extra steps to be certain our customers receive the best laser cut product available. Laser cutting has become a key component in higher and more reliable performance of electronics components. Our group will always strive to outperform and raise the bar for laser cutting and laser micromachining services in today’s market.